multilayer ceramic chip capacitors 1 of 3 creation date : may 15, 2017 (gmt) c2012jb1h474k125ab tdk item description c2012jb1h474kt**** applications commercial grade feature general general (up to 50v) series c2012 [eia 0805] status production (not recommended for new design) size length(l) 2.00mm 0.20mm width(w) 1.25mm 0.20mm thickness(t) 1.25mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) 0.50mm min. recommended land pattern (pa) 1.00mm to 1.30mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) recommended land pattern (pb) 1.00mm to 1.20mm(flow soldering) 0.70mm to 0.90mm(re?ow soldering) recommended land pattern (pc) 0.80mm to 1.10mm(flow soldering) 0.90mm to 1.20mm(re?ow soldering) electrical characteristics capacitance 470nf 10% rated voltage 50vdc temperature characteristic jb(10%) dissipation factor (max.) 5% insulation resistance (min.) 1063m other soldering method wave (flow) re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 2000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : may 15, 2017 (gmt) c2012jb1h474k125ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c2012jb1h474k125ab esr c2012jb1h474k125ab capacitance c2012jb1h474k125ab dc bias characteristic c2012jb1h474k125ab temperature characteristic c2012jb1h474k125ab(no bias) c2012jb1h474k125ab(dc bias = 25v ) ripple temperature rising c2012jb1h474k125ab(100khz) c2012jb1h474k125ab(500khz) c2012jb1h474k125ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : may 15, 2017 (gmt) c2012jb1h474k125ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
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